CEVA and VisiSonics Bring 3D Spatial Audio to True Wireless Earbuds and Headphones for the Ultimate Hearing Experience
Companies collaborate to develop high precision 3D spatial audio embedded solution optimized for hearables, combining RealSpace® 3D audio software from VisiSonics with CEVA’s low power audio and sensor hub DSPs and MotionEngine™ head tracking algorithms
MOUNTAIN VIEW, Calif., Sept. 23, 2020 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of best-in-class, patented 3D spatial audio technologies, announced today that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables.
