CEVA and VisiSonics Bring 3D Spatial Audio to True Wireless Earbuds and Headphones for the Ultimate Hearing Experience

CEVA Logo - 3D Spatial Audio - VisiSonics

Companies collaborate to develop high precision 3D spatial audio embedded solution optimized for hearables, combining RealSpace® 3D audio software from VisiSonics with CEVA’s low power audio and sensor hub DSPs and MotionEngine™ head tracking algorithms

MOUNTAIN VIEW, Calif.Sept. 23, 2020 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of best-in-class, patented 3D spatial audio technologies, announced today that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables.

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